CLC FALIT TRIO Laser System
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Mobile tower, motorized zoom video microscope, full functions
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Description
CLC FALIT TRIO Laser System
FALIT TRIO is a freestanding, tri-head laser model based on laboratory applications, with the concept of a freestanding workstation to meet many different needs.
The available processing field is 33x33 mm (Maximum 1.3-in size IC Chip), if the XY table option is selected, the Chip-on-Board PCBA processing will be achieved by moving the XY table.
This device provides users with versatile functions for de-capping and removing a wider range of IC packaging materials from epoxy molding compounds to transparent gels or silicones, cross-sectioning IC Chips, cutting PCBA, de-lidding metal covers, and removing the metal caps.
It replaces the traditional destructive analysis methods of mechanical micro-drilling, mechanical cutting, and chemical etching.
Performance Design:
*Exclusive IC chip cross-sectioning laser controller with an in-house designed embedded system ensures the cutting kerf is well controlled.*In the primary processing position, the system configuration is a 20W ICO laser, with higher power laser options available.
*In the secondary processing position, the system configuration is a 30-Watt Gel laser, with higher power laser options available.
*In the tertiary processing position, the system configuration is a 10 Watt Green Laser, enhanced higher power green lasers and UV laser options are available.
*Standard configuration with Supreme LMMS Trio Version software.
*Standard configuration with the continuous motorized zoom vision system, high-resolution camera options are available.
*Standard configuration with 150x600 mm traveling programmable XY table, with larger size XY Table options available if necessary for special applications. With this option, the de-cap area, gel removal area, cross-sectioning area, and the vision field can be expanded. The process for Chip-On-Board PCBA is feasible, simplifying the post-process of an electrical test.
*The option for a Cool Blast or a Cool Plate is available to ensure a harmless de-cap process on thermal sensitive silicon chips or extremely thin bonding wires.
*An Auto Focus Finder with a motion control unit is available to precisely record and duplicate laser de-cap recipes with programmable focus finding motion control.
Safety Design:
*The workstation designed as CDRH Class-I compliance, to get rid of an employer’s worker's compensation liability risk.*The workstation is equipped with advanced Air Pack with multiple nozzles, to keep the optical components clean.
*The workstation includes an IR-Blocking Laser Safety Viewing Window, to ensure no damage to the operator’s eyes.
*The workstation design is compatible with the integration of fume extraction equipment, to ensure the air quality of the workplace.
Link til CLC: https://www.controllaser.com/products/falit-failure-analysis-laser-inspection-forensic-research/?tag=DUO&package=2
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CLC FALIT TRIO Laser System
FALIT TRIO is a freestanding, tri-head laser model based on laboratory applications, with the concept of a freestanding workstation to meet many different needs.
The available processing field is 33x33 mm (Maximum 1.3-in size IC Chip), if the XY table option is selected, the Chip-on-Board PCBA processing will be achieved by moving the XY table.
This device provides users with versatile functions for de-capping and removing a wider range of IC packaging materials from epoxy molding compounds to transparent gels or silicones, cross-sectioning IC Chips, cutting PCBA, de-lidding metal covers, and removing the metal caps.
It replaces the traditional destructive analysis methods of mechanical micro-drilling, mechanical cutting, and chemical etching.
Performance Design:
*Exclusive IC chip cross-sectioning laser controller with an in-house designed embedded system ensures the cutting kerf is well controlled.*In the primary processing position, the system configuration is a 20W ICO laser, with higher power laser options available.
*In the secondary processing position, the system configuration is a 30-Watt Gel laser, with higher power laser options available.
*In the tertiary processing position, the system configuration is a 10 Watt Green Laser, enhanced higher power green lasers and UV laser options are available.
*Standard configuration with Supreme LMMS Trio Version software.
*Standard configuration with the continuous motorized zoom vision system, high-resolution camera options are available.
*Standard configuration with 150x600 mm traveling programmable XY table, with larger size XY Table options available if necessary for special applications. With this option, the de-cap area, gel removal area, cross-sectioning area, and the vision field can be expanded. The process for Chip-On-Board PCBA is feasible, simplifying the post-process of an electrical test.
*The option for a Cool Blast or a Cool Plate is available to ensure a harmless de-cap process on thermal sensitive silicon chips or extremely thin bonding wires.
*An Auto Focus Finder with a motion control unit is available to precisely record and duplicate laser de-cap recipes with programmable focus finding motion control.
Safety Design:
*The workstation designed as CDRH Class-I compliance, to get rid of an employer’s worker's compensation liability risk.*The workstation is equipped with advanced Air Pack with multiple nozzles, to keep the optical components clean.
*The workstation includes an IR-Blocking Laser Safety Viewing Window, to ensure no damage to the operator’s eyes.
*The workstation design is compatible with the integration of fume extraction equipment, to ensure the air quality of the workplace.
Link til CLC: https://www.controllaser.com/products/falit-failure-analysis-laser-inspection-forensic-research/?tag=DUO&package=2