CLC FALIT XSEC Laser System
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Compact model based on laboratory applications, fit for a large size workbench.
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Description
CLC FALIT XSEC Laser System
FALIT XSEC is a compact model based on laboratory applications, fit for a large size workbench.
The available processing field is 33x33 mm (Maximum 1.3-in size IC Chip), if the XY table option is selected, the Chip-On-Board PCBA processing will be achieved by moving the XY table.
This FALIT XSEC is designed for IC chip laser cross-sectioning, metal cover de-lidding, metal cap removing, and PCBA cutting.
It replaces the traditional destructive analysis methods of mechanical micro-drilling, mechanical cutting, and chemical etching.
Wheeled legs are available to improve the mobility of the machine.
Performance Design:
*Exclusive IC chip cross-sectioning laser controller with an in-house designed embedded system ensures the cutting kerf is well controlled.*Standard configuration with 10 Watt Green Laser, enhanced higher power green lasers and UV laser options are available.
*Standard configuration with Professional LMMS Solo Version software.
*Standard configuration with the continuous motorized zoom vision system. The option of a high-resolution camera is available for upgrade.
*A Programmable XY Table option is available. With this option, the cross-sectioning and vision field can be expanded. The process for Chip-On-Board PCBA is feasible, simplifying the post-process for an electrical test.
*The option for a Cool Blast or a Cool Plate is available to ensure a harmless de-cap process on thermal sensitive silicon chips or extremely thin bonding wires.
*An Auto Focus Finder with a motion control unit is available to precisely record and duplicate laser de-cap recipes.
Safety Design:
*The workstation designed as CDRH Class-I compliance, to get rid of an employer’s worker's compensation liability risk.*The workstation is equipped with advanced Air Pack with multiple nozzles, to keep the optical components clean.
*The workstation includes an IR-Blocking Laser Safety Viewing Window, to ensure no damage to the operator’s eyes.
*The workstation design is compatible with the integration of fume extraction equipment, to ensure the air quality of the workplace.
Link til CLC: https://www.controllaser.com/products/falit-failure-analysis-laser-inspection-forensic-research/?tag=DUO&package=2
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CLC FALIT XSEC Laser System
FALIT XSEC is a compact model based on laboratory applications, fit for a large size workbench.
The available processing field is 33x33 mm (Maximum 1.3-in size IC Chip), if the XY table option is selected, the Chip-On-Board PCBA processing will be achieved by moving the XY table.
This FALIT XSEC is designed for IC chip laser cross-sectioning, metal cover de-lidding, metal cap removing, and PCBA cutting.
It replaces the traditional destructive analysis methods of mechanical micro-drilling, mechanical cutting, and chemical etching.
Wheeled legs are available to improve the mobility of the machine.
Performance Design:
*Exclusive IC chip cross-sectioning laser controller with an in-house designed embedded system ensures the cutting kerf is well controlled.*Standard configuration with 10 Watt Green Laser, enhanced higher power green lasers and UV laser options are available.
*Standard configuration with Professional LMMS Solo Version software.
*Standard configuration with the continuous motorized zoom vision system. The option of a high-resolution camera is available for upgrade.
*A Programmable XY Table option is available. With this option, the cross-sectioning and vision field can be expanded. The process for Chip-On-Board PCBA is feasible, simplifying the post-process for an electrical test.
*The option for a Cool Blast or a Cool Plate is available to ensure a harmless de-cap process on thermal sensitive silicon chips or extremely thin bonding wires.
*An Auto Focus Finder with a motion control unit is available to precisely record and duplicate laser de-cap recipes.
Safety Design:
*The workstation designed as CDRH Class-I compliance, to get rid of an employer’s worker's compensation liability risk.*The workstation is equipped with advanced Air Pack with multiple nozzles, to keep the optical components clean.
*The workstation includes an IR-Blocking Laser Safety Viewing Window, to ensure no damage to the operator’s eyes.
*The workstation design is compatible with the integration of fume extraction equipment, to ensure the air quality of the workplace.
Link til CLC: https://www.controllaser.com/products/falit-failure-analysis-laser-inspection-forensic-research/?tag=DUO&package=2